In a latest update, Sony and Taiwan Semiconductor Manufacturing Company TSMC are planning a massive joint investment of roughly 1 trillion yen ($6.3 billion) to produce next-generation image sensors.
The collaboration will operate through a dedicated joint venture based in Kumamoto Prefecture, Southern Japan.
As reported by Nikkei Business Daily on Monday, a joint venture owned about 60% by Sony and 40% by TSMC will start commercial mass production as early as 2029.
Sony is the world’s largest maker of image sensors widely used in smartphones and autos, while TSMC is the world’s largest contract chipmaker.
Previously, the two tech giants expressed that they planned to form a joint venture in Japan to develop and manufacture next-generation image sensors, combining Sony’s sensor design expertise with TSMC’s manufacturing and process technology strengths.
Back in May, Sony Semiconductor Solutions and TSMC signed a preliminary memorandum of understanding (MOU) to lay the groundwork for the latest strategic partnership.
The initiative will combine Sony’s market-leading image sensor design expertise with TSMC’s cutting-edge process technology and chip manufacturing scale.
Sony and TSMC said the advance partnership will explore new opportunities as the initiative aims to push beyond traditional smartphone applications, targeting high-growth sectors like autonomous vehicles, industrial robotics, and physical AI.
As reported, the new joint venture between the tech giants, is separate from TSMC’s existing logic-chip foundry project in Kumamoto ‘JASM’, focusing entirely on advanced microchips used for sensing and imaging.
